SoC: Packaging and Signal Integrity
This course explores the core principles of signal integrity and packaging in IC design. It includes comprehensive topics such as chip interconnect, transmission lines, impedance matching, and power distribution networks, as well as EMI/EMC, ESD protection, thermal considerations, and IC failure and reliability.
Course Contents
- •Signal Integrity Principles
- •Chip Interconnect and Transmission Lines
- •PCB and IC Materials
- •Impedance Matching
- •Power Distribution Network
- •Parallelism & Crosstalk
- •EMI and EMC
- •Reflections and Termination
- •IO Pads
- •On-Chip Passives
- •ESD Protection Management
- •IC and Discrete Component Packaging
- •Thermal Considerations
- •IC Failure and Reliability
- •Microsystems Packaging and Applications
Lab Topics
- •Impedance Matching using Lumped Model
- •Impedance Matching using Microstrip Model
- •EMC and Transmission Line Discontinuity Modeling and Simulation
- •Bond Wire Modeling and Simulations
- •Power Distribution Network Modeling
- •Parallelism Transmission Line Modeling & Analysis
- •Crosstalk and Noise Analysis
- •EMI/EMC Interference Analysis
- •On-Chip Passives and Corner Analysis
Course Learning Outcomes
- •Understand and apply signal integrity principles in IC design.
- •Design and analyze chip interconnects, transmission lines, and impedance matching.
- •Implement power distribution networks and manage thermal considerations in ICs.
- •Address EMI/EMC challenges and design ESD protection for ICs.
- •Analyze IC failure mechanisms and enhance reliability through robust design practices.