IC Design Project: From Concept to Tapeout
This project focuses on designing and fabricating high-performance VLSI circuits using TSMC’s 130/65 nm Skywater 130nm or TSMC 180BCD CMOS technology PDK. It includes comprehensive digital, analog, and mixed-signal design flows and emphasizes teamwork and advanced circuit techniques.
Course Contents
- •Digital Design Flow: ALU, CLBs, TRNG, etc.
- •Analog Design Flow: Oscillators, Opamps, OTAs, Bandgap references, etc.
- •Mixed-Signal Design Flow: PLLs, ADCs, DACs, ΣΔ converters, etc.
- •Advanced Circuit Techniques
- •ESD-Aware Pad Frame Design
- •Power Distribution Network (PDN) Design
- •Chip Layout and Sign-Off
- •Promotion of Teamwork
Course Learning Outcomes
- •Apply digital, analog, and mixed-signal design flows to VLSI circuit design.
- •Implement advanced circuit techniques and ESD-aware pad frame design.
- •Design and analyze power distribution networks for ICs.
- •Collaborate effectively in a team environment to manage complex VLSI projects.
- •Complete the chip layout and sign-off process for VLSI circuits.
Project Examples
- •Hands-on self-paced lab work with an estimated time of 30 to 40 hours each week per student.
- •IC fabrication and packaging cost details are provided in the budget.